Microwaved multi-ply structures, microwaved packages, and methods of sterilization

ABSTRACT

Multi-ply structures are provided that include a barrier film, which has a first polyester layer and a silicon oxide layer, a first adhesive layer, and a sealant film, where the first adhesive layer is located between the barrier film and the sealant film, and where the multi-ply structure has been microwaved in a pressurized vessel. Packages that are formed from the multi-ply structures are also provided in which these packages are microwaved in a pressurized vessel. Methods for sterilization are also provided.

BACKGROUND

Thermal retort processes have long been used to provide commercialpasteurization and sterilization to improve the microbial safety ofrefrigerated or shelf-stable food products. In retort processes, theproducts are heated to temperatures effective to inactivatemicroorganisms, including spoilage or pathogenic microorganisms, whichmay be present in the food.

Conventional thermal retort processes generally require high temperaturetreatment, typically ranging from 121° C. to 132° C. for upwards of 40minutes including heating, holding, and cooling stages. The most commonretort sterilization processes include water immersion and saturatedsteam processes. In saturated steam processes, a retort vesselcontaining packaged products (e.g., in pouches, containers, or cans) isfilled with steam for about 30 to about 120 minutes. In water immersionprocesses, the food products are immersed in hot water under pressure ina retort vessel. While acceptable sterilization may be achieved by theseprocesses, thermal treatment for these lengths of time can result in anumber of detrimental effects to the food product, including changes incolor, aroma, or texture, denaturation or coagulation of protein, anddegradation of vitamins and other nutrients.

Given the foregoing drawbacks of conventional retort processes, there isinterest in retort processing using microwave energy, such as microwaveassisted thermal sterilization (MATS). In MATS, unlike with conventionalthermal retort processes, heat is produced directly in the food, therebysubstantially reducing the thermal processing time necessary toeffectively sterilize the food. As a result, MATS processes, as comparedto conventional thermal retort processes, can have, among otherattributes, higher throughputs and lower operation costs. Further, thecolor, texture and other sensory attributes of MATS processed foods canbe better compared with those of conventional thermal retorted foods.

Although MATS processes are efficient sterilization processes, they canbe harsh on packaging materials because of the temperature and pressurevariations involved. Therefore, MATS processes can have an adverseeffect on the barrier properties, e.g., the moisture vapor transmissionrate (MVTR) and the oxygen transmission rate (OTR), of the resultingmicrowaved packaging materials. Given that the MVTR and the OTR areimportant properties of suitable food packaging, it is desirable toreduce these effects by employing suitable packaging material that canbetter withstand the processing conditions of MATS processes.

Accordingly, there exists a need to provide improved packaging material,such as improved multi-ply structures, that are capable of beingsterilized in a MATS process wherein the resulting microwaved materialhas greater moisture and oxygen barrier properties as compared toconventional packaging material.

SUMMARY

In one aspect, multi-ply structures are provided. In one or moreembodiments, the multi-ply structure includes a barrier film, whichcomprises a first polyester layer and a silicon oxide layer, a firstadhesive layer, and a sealant film, wherein the first adhesive layer islocated between the barrier film and the sealant film, and wherein themulti-ply structure has been microwaved in a pressurized vessel.

In another aspect, packages are provided. In one or more embodiments,the package includes a multi-ply structure that defines an interiorspace of the package, and a product disposed within the interior space,wherein the package has been microwaved in a pressurized vessel. In oneor more other embodiments, the package includes a container body havinga rim, the container body defining an interior space of the package,product disposed within the interior space, and a multi-ply structureaffixed to the rim, wherein the package has been microwaved in apressurized vessel. In either embodiment, the multi-ply structureincludes a barrier film comprising a first polyester layer and a siliconoxide layer, a first adhesive layer, and a sealant film, wherein thefirst adhesive layer is located between the barrier film and the sealantfilm.

In yet another aspect, methods for sterilization are provided. In one ormore embodiments, the method includes feeding a package into apressurized vessel, the package having product disposed within aninterior space of the package, and exposing the package and the productwithin the pressurized vessel to one or more cycles of microwave energy.The package includes a multi-ply structure that includes a barrier filmcomprising a first polyester layer and a silicon oxide layer, a firstadhesive layer, and a sealant film, wherein the first adhesive layer islocated between the barrier film and the sealant film.

BRIEF DESCRIPTION OF THE DRAWINGS

The detailed description is set forth with reference to the accompanyingdrawings. The use of the same reference numerals may indicate similar oridentical items. Various embodiments may utilize elements and/orcomponents other than those illustrated in the drawings, and someelements and/or components may not be present in various embodiments.Elements and/or components in the figures are not necessarily drawn toscale.

FIG. 1 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 2 is across-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 3 is across-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 4 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 5 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 6 is across-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 7 is across-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 8 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 9 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 10 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 11 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 12 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 13 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 14 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 15 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 16 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 17 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 18 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 19 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 20 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 21 is a cross-sectional view of a multi-ply structure in accordancewith an embodiment of the present disclosure.

FIG. 22 is a cross-sectional view of a sealant film in accordance withan embodiment of the present disclosure.

FIG. 23 is a cross-sectional view of a sealant film in accordance withan embodiment of the present disclosure.

FIG. 24 is a cross-sectional view of a sealant film in accordance withan embodiment of the present disclosure.

FIG. 25 is a cross-sectional view of a sealant film in accordance withan embodiment of the present disclosure.

FIG. 26 is a cross-sectional view of a sealant film in accordance withan embodiment of the present disclosure.

FIG. 27 is a cross-sectional view of a sealant film in accordance withan embodiment of the present disclosure.

FIG. 28 is a cross-sectional view of a sealant film in accordance withan embodiment of the present disclosure.

FIG. 29 is a perspective view of a package, which is in the form of anexemplary stand-up pouch, in accordance with an embodiment of thepresent disclosure.

FIG. 30 is a side elevation view of a package including a lidding formedfrom a multi-ply structure in accordance with an embodiment of thepresent disclosure.

FIG. 31 is a process flow diagram that illustrates a method forsterilization in accordance with an embodiment of the presentdisclosure.

DETAILED DESCRIPTION

Improved multi-ply structures have been developed that address one ormore challenges that arise with sterilizing conventional multi-plystructures via microwave-assisted thermal sterilization (MATS)processes. The present multi-ply structures include a barrier filmhaving a polyester layer and a silicon oxide layer, which advantageouslyprotect the multi-ply structures during a MATS process, such that theresulting microwaved multi-ply structures have higher barrier propertiesas compared to conventional microwaved multi-ply structures.

Several embodiments of multi-ply structures and methods for making thestructures, packages and methods for making the packages, and methods ofsterilization are described herein. Parameters of different steps,components, and features of the embodiments are described separately,but may be combined consistently with this description of claims, toenable other embodiments as well to be understood by those skilled inthe art. Various terms used herein are likewise defined in thedescription which follows.

Values or ranges may be expressed herein as “about”, from “about” oneparticular value, and/or to “about” another particular value. When suchvalues or ranges are expressed, other embodiments disclosed include thespecific value recited, from the one particular value, and/or to theother particular value. Similarly, when values are expressed asapproximations, by use of the antecedent “about,” it will be understoodthat the particular value forms another embodiment. It will be furtherunderstood that there are a number of values disclosed therein, and thateach value is also herein disclosed as “about” that particular value inaddition to the value itself. In embodiments, “about” can be used tomean, for example, within 10% of the recited value, within 5% of therecited value, or within 2% of the recited value.

Microwaved Multi-Ply Structures and Methods of Manufacture

In accordance with the description, microwaved multi-ply structures thatinclude at least a barrier film, which includes a first polyester layerand a silicon oxide layer, a first adhesive layer, and a sealant filmhave been developed.

It is also contemplated within this disclosure that in certainembodiments, the polyester layer may be replaced with a biaxiallyoriented nylon layer.

As used herein, the term “microwaved” when used to modify a multi-plystructure or a package means that the structure or the package wasmicrowaved, i.e., exposed to microwave energy, in a pressurized vessel.That is, the multi-ply structures or the packages of the presentdisclosure underwent a MATS process, such as those described herein andin U.S. Pat. Nos. 5,436,432, 5,750,966, 7,119,313, 7,230,217, 9,066,376,9,179,505, and 9,271,338, and in International Publication Nos WO2016/044571, WO 2016/100539, and WO 2015/171763, all of which areincorporated herein by reference. In some embodiments, the pressurizedvessel includes a fluid medium. In some embodiments, the pressurizedvessel includes a liquid and the multi-ply structure or the package isat least partially immersed in the liquid.

In embodiments, the microwaved multi-ply structures or packages of thepresent disclosure are sterilized during the MATS process. Additionallyin embodiments where a product is disposed within the package, theproduct is sterilized during the MATS process. In certain embodiments,the product is a food or drink product, and the product is alsopasteurized during the MATS process.

One embodiment of a microwaved multi-ply structure is shown in FIG. 1.The microwaved multi-ply structure 100 includes a barrier film 102,which includes a first polyester layer 104 and a silicon oxide layer106. The microwaved multi-ply structure 100 further includes a sealantfilm 110 and a first adhesive layer 108. The first adhesive layer 108 islocated between the barrier film 102 and the sealant film 110. In thisembodiment, the first polyester layer 104 is the outermost layer of themulti-ply structure 100.

In some embodiments, the microwaved multi-ply structure is flexible. Insome embodiments, the microwaved multi-ply structure is substantiallypolymeric. In certain embodiments, the microwaved multi-ply structure isflexible and substantially polymeric.

As used herein, “substantially polymeric” means having a polymer contentof at least 90% based on weight of the multi-ply structure. For example,in some embodiments, the multi-ply structure has a polymer content ofabout 90% to about 99.9% based on weight of the multi-ply structure. Insome embodiments, the multi-ply structure has a polymer content of about90% to about 95% based on weight of the multi-ply structure. In someembodiments, the multi-ply structure has a polymer content of about 95%to about 99.9% based on weight of the multi-ply structure.

In some embodiments, the barrier film has a thickness from about 36gauge to 120 gauge, however, the thickness of the barrier film can varydepending on desired package specifications.

As used herein, “outermost layer” means the first layer that is viewedfrom the outside of a laminated structure and will typically be theoutermost layer of a package made with such a structure (e.g., a pouch)or the outermost layer of the portion of a package made with suchstructure (e.g., lidding).

As used herein, a “polyester layer” is a layer that predominatelycomprises one or more polyesters. That is, a polyester layer comprisesone or more polyesters in an amount of at least 50% based on weight ofthe polyester layer. In one embodiment, the polyester layer comprisesone or more polyesters in an amount of about 80% to about 100% based onweight of the polyester layer. In another embodiment, the polyesterlayer comprises one or more polyesters in an amount of about 95% toabout 100% based on weight of the polyester layer.

A non-limiting example of a suitable polyester includes polyethyleneterephthalate (PET), such as biaxially oriented PET (BOPET). It is alsocontemplated that the one or more polyesters do not include any otherpolyesters other than PET.

As used herein, an “adhesive layer” is a layer that adheres or bondsdifferent films and/or layers of the microwaved multi-ply structuretogether. Non-limiting examples of suitable adhesive layer materials aresolvent-based adhesives, water-based adhesives, and solvent-lessadhesives. Suitable adhesives include, but are not limited tosolvent-based polyurethane adhesives.

In embodiments, an adhesive layer is not used to bond the layers of thebarrier film together. That is, the barrier film of the presentmicrowaved multi-ply structures does not comprise an adhesive layer. Forexample, in some embodiments, the silicon oxide layer is vacuumdeposited, e.g., by physical or chemical vapor deposition, onto asurface of the first polyester layer.

Inventors have unexpectedly discovered that the present microwavedmulti-ply structures have lower moisture vapor transmission rates, loweroxygen transmission rates, or both as compared to a conventionalmicrowaved multi-ply structure, see e.g., Example 1.

Further, it was also discovered that the present microwaved multi-plystructures have at least a lower moisture vapor transmission rate ascompared to a comparative structure that has undergone a conventionalthermal retort process, see e.g., Example 2. In some instances, thepresent microwaved multi-ply structures were also found to have a loweroxygen transmission rate than the comparative structures that underwentconventional retorted structures.

The moisture vapor transmission rate is the steady state rate at whichwater vapor permeates through a structure at specified conditions oftemperature and relative humidity, and can be determined using ASTMF1249.

The oxygen transmission rate is the steady state rate at which oxygengas permeates through a structure at specified conditions of temperatureand zero relative humidity, and can be determined using ASTM D3955.

As used herein, a “conventional microwaved multi-ply structure” is astructure that does not include a combination of at least a sealantfilm, a first adhesive layer, and a barrier film in which the barrierfilm comprises a first polyester layer and a silicon oxide layer. Forexample, in some embodiments, a conventional microwaved multi-plystructure has a barrier film that includes aluminum oxide and notsilicon oxide, such as an aluminum oxide coated PET.

As used herein, a “comparative multi-ply structure” is simply anon-microwaved sample of the subject microwaved multi-ply structure.That is, the comparative multi-ply structure is the same structure asthe microwaved structure except that the comparative multi-ply structurehas not been microwaved (i.e., the comparative multi-ply structure hasnot undergone a MATS process). In some instances, the comparativemulti-ply structure has not undergone any thermal retort process,whereas in other instances, the comparative multi-ply structure hasundergone a conventional thermal retort process. Similarly, a“comparative moisture vapor transmission rate” when used herein to referto the moisture vapor transmission rate of a “comparative multi-plystructure” is measured under the same conditions and parameters as themeasured moisture vapor transmission rate value of the microwavedmulti-ply structure in accordance with the present disclosure.

As used herein, a “conventional thermal retort process” is any thermalretort process other than a MATS process.

In some embodiments, the microwaved multi-ply structure has a moisturevapor transmission rate from about 0.005 g/100 in²/day to about 0.06g/100 in²/day. In one embodiment, the microwaved multi-ply structure hasa moisture vapor transmission rate from about 0.01 g/100 in²/day toabout 0.03 g/100 in²/day. In another embodiment, the microwavedmulti-ply structure has a moisture vapor transmission rate from about0.05 g/100 in²/day to about 0.06 g/100 in²/day. In other embodiments,the microwaved multi-ply structure has a moisture vapor transmissionrate of 0.005, 0.01 g/100 in²/day, 0.015 g/100 in²/day, 0.02 g/100in²/day, 0.025 g/100 in²/day, 0.03 g/100 in²/day, 0.035 g/100 in²/day,0.04 g/100 in²/day, 0.045 g/100 in²/day, 0.05 g/100 in²/day, 0.055 g/100in²/day, 0.06 g/100 in²/day. The microwaved multi-ply structure of thisdisclosure can also have a moisture vapor transmission rate between anyof these recited moisture vapor transmission rates.

As used herein, a “comparative moisture vapor transmission rate” whenused herein to refer to the moisture vapor transmission rate of a“conventional microwaved multi-ply structure” is measured under the sameconditions and parameters as the measured moisture vapor transmissionrate value of the microwaved multi-ply structure in accordance with thepresent disclosure.

As used herein, a “comparative moisture vapor transmission rate” whenused herein to refer to the moisture vapor transmission rate of a“comparative microwaved multi-ply structure” is measured under the sameconditions and parameters as the measured moisture vapor transmissionrate value of the microwaved multi-ply structure in accordance with thepresent disclosure.

In certain embodiments, the present microwaved multi-ply structures havea moisture vapor transmission rate that is lower than a comparativemoisture vapor transmission rate of a conventional microwaved multi-plystructure. For example, in some embodiments, the present microwavedmulti-ply structure has a moisture vapor transmission rate that is up to100% lower than a comparative moisture vapor transmission rate of aconventional microwaved multi-ply structure. In one embodiment, thepresent microwaved multi-ply structure has a moisture vapor transmissionrate that is about 50% to about 100% lower than a comparative moisturevapor transmission rate of a conventional microwaved multi-plystructure. In another embodiment, the microwaved multi-ply structure hasa moisture vapor transmission rate that is about 70% to about 85% lowerthan a comparative moisture vapor transmission rate of a conventionalmicrowaved multi-ply structure. In yet another embodiment, themicrowaved multi-ply structure has a moisture vapor transmission ratethat is about 80% to about 95% lower than a comparative moisture vaportransmission rate of a conventional microwaved multi-ply structure. Inother embodiments, the microwaved multi-ply structure has a moisturevapor transmission rate that is 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%,90%, 95%, 99%, or 100% lower than a comparative moisture vaportransmission rate of a conventional microwaved multi-ply structure. Themicrowaved multi-ply structure of this disclosure also may have amoisture vapor transmission rate that is lower than a comparativemoisture vapor transmission rate of the conventional microwavedmulti-ply structure at a percent value in a range between any of theserecited percent values.

In some embodiments, the microwaved multi-ply structure has a moisturevapor transmission rate that is about 0% to about 1,100% greater than acomparative moisture vapor transmission rate of a comparative multi-plystructure that has not been microwaved in the pressurized vessel. In oneembodiment, the microwaved multi-ply structure has a moisture vaportransmission rate that is about 0% to about 700% greater than acomparative moisture vapor transmission rate of a comparative multi-plystructure that has not been microwaved in the pressurized vessel. Inanother embodiment, the microwaved multi-ply structure has a moisturevapor transmission rate that is about 30% to about 250% greater than acomparative moisture vapor transmission rate of a comparative multi-plystructure that has not been microwaved in the pressurized vessel. Inother embodiments, the microwaved multi-ply structure has a moisturevapor transmission rate that is 0%, 0.01%, 0.1%, 0.5%, 10%, 5%, 10%,20%, 30%, 40%, 50%, 60% 70%, 80%, 90%, 100%, 150%, 200%, 2.50%, 300%,350%, 400% 450%, 500%, 550%, 600%, 650%, 700%, 750%, 800%, 850%, 900%,950%, 1,000%, or 1,100% greater than a comparative moisture vaportransmission rate of a comparative multi-ply structure that has not beenmicrowaved in the pressurized vessel. The microwaved multi-ply structureof this disclosure also may have a moisture vapor transmission rate thatis greater than the comparative moisture vapor transmission rate at apercent value in a range between any of these recited percent values.

In some embodiments, the microwaved multi-ply structure has an oxygentransmission rate from about 0.001 cc/l 00 in²/day to about 0.03 cc/100in²/day. In one embodiment, the microwaved multi-ply structure has anoxygen transmission rate from about 0.002 cc/100 in²/day to about 0.02cc/100 in²/day. In another embodiment, the microwaved multi-plystructure has an oxygen transmission rate from about 0.006 cc/100in²/day to about 0.01 cc/100 in²/day. In other embodiments, themicrowaved multi-ply structure has an oxygen transmission rate of 0.001cc/100 in²/day, 0.002 cc/100 in²/day, 0.003 cc/100 in²/day, 0.004 cc/100in²/day, 0.005 cc/100 in²/day, 0.006 cc/100 in²/day, 0.007 cc/100in²/day, 0.008 cc/100 in²/day, 0.009 cc/100 in²/day, 0.01 cc/100in²/day, 0.015 cc/100 in²/day, 0.02 cc/100 in²/day, 0.025 cc/100in²/day, 0.03 cc/100 in²/day. The microwaved multi-ply structure of thisdisclosure also may have an oxygen transmission rate between any ofthese recited oxygen transmission rates.

In one embodiment, the microwaved multi-ply structure has a moisturevapor transmission rate from about 0.005 g/100 in²/day to about 0.06g/100 in²/day and an oxygen transmission rate from about 0.001 cc/100in²/day to about 0.03 cc/100 in²/day.

As used herein, a “comparative oxygen transmission rate” when usedherein to refer to the oxygen transmission rate of a “conventionalmicrowaved multi-ply structure” is measured under the same conditionsand parameters as the measured oxygen transmission rate value of themicrowaved multi-ply structure in accordance with the presentdisclosure.

As used herein, a “comparative oxygen transmission rate” when usedherein to refer to the oxygen transmission rate of a “comparativemulti-ply structure” that has not undergone any thermal retort processis measured under the same conditions and parameters as the measuredoxygen transmission rate value of the microwaved multi-ply structure inaccordance with the present disclosure.

As used herein, a “comparative oxygen transmission rate” when usedherein to refer to the oxygen transmission rate of a “comparativemulti-ply structure” that has undergone a conventional thermal retortprocess is measured under the similar conditions and parameters as themeasured oxygen transmission rate value of the microwaved multi-plystructure in accordance with the present disclosure.

In certain embodiments, the present microwaved multi-ply structures havean oxygen transmission rate that is lower than a comparative oxygentransmission rate of a conventional microwaved multi-ply structure. Forexample, in some embodiments, the present microwaved multi-ply structurehas an oxygen transmission rate that is up to 100% lower than acomparative oxygen transmission rate of a conventional microwavedmulti-ply structure. In one embodiment, the present microwaved multi-plystructure has an oxygen transmission rate that is between 0% to 100%lower than a comparative oxygen transmission rate of a conventionalmicrowaved multi-ply structure. In another embodiment, the microwavedmulti-ply structure has an oxygen transmission rate that is about 50% toabout 99% lower than a comparative oxygen transmission rate of aconventional microwaved multi-ply structure. In yet another embodiment,the microwaved multi-ply structure has an oxygen transmission rate thatis about 64% to about 90% lower than a comparative oxygen transmissionrate of a conventional microwaved multi-ply structure. In otherembodiments, the microwaved multi-ply structure has an oxygentransmission rate that is 1%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%,45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 99%, or 100%lower than a comparative oxygen transmission rate of a conventionalmicrowaved multi-ply structure. The microwaved multi-ply structure ofthis disclosure also may have an oxygen transmission rate that is lowerthan a comparative oxygen transmission rate of the conventionalmicrowaved multi-ply structure at a percent value in a range between anyof these recited percent values.

In one embodiment, the microwaved multi-ply structure has a moisturevapor transmission rate that is about 50% to about 99% lower than acomparative moisture vapor transmission rate of a conventional multi-plystructure, and the microwaved multi-ply structure has an oxygentransmission rate that is between 0% to 100% lower than a comparativeoxygen transmission rate of a conventional multi-ply structure.

In some embodiments, the microwaved multi-ply structure has an oxygentransmission rate that is about 0% to about 2,900% greater than acomparative oxygen transmission rate of a comparative multi-plystructure that has not been microwaved in the pressurized vessel. In oneembodiment, the microwaved multi-ply structure has an oxygentransmission rate that is about 0% to about 620% greater than acomparative oxygen transmission rate of a comparative multi-plystructure that has not been microwaved in the pressurized vessel. Inanother embodiment, the microwaved multi-ply structure has an oxygentransmission rate that is about 110% to about 260% greater than acomparative oxygen transmission rate of a comparative multi-plystructure that has not been microwaved in the pressurized vessel. Inother embodiments, the microwaved multi-ply structure has an oxygentransmission rate that is 0%, 0.01%, 0.1%, 0.5%, 1%, 5%, 10%, 20%, 30%,40%, 50%, 60% 70%, 80%, 90%, 100%, 150%, 200%, 250%, 300%, 350%, 400%450%, 500%, 550%, 600%, 650%, 700%, 750%, 800%, 850%, 900%, 950%,1,000%, 1,100%, 1,200%, 1,300%, 1,400%, 1,500%, 1,600%, 1,700%, 1,800%,1,900%, 2,000%, 2,100%, 2,200%, 2,300%, 2,400%, 2,500%, 2,600%, 2,700%,2,800%, or 2,900% greater than a comparative oxygen transmission rate ofa comparative multi-ply structure that has not been microwaved in thepressurized vessel. The microwaved multi-ply structure of thisdisclosure also may have an oxygen transmission rate that is greaterthan the comparative oxygen transmission rate at a percent value in arange between any of these recited percent values.

In one embodiment, the microwaved multi-ply structure has a moisturevapor transmission rate that is about 0% to about 1.100% greater than acomparative moisture vapor transmission rate of a comparative multi-plystructure that has not been microwaved in the pressurized vessel, andthe microwaved multi-ply structure has an oxygen transmission rate thatis about 0% to about 2,900% greater than a comparative oxygentransmission rate of the comparative multi-ply structure.

In some embodiments, the microwaved multi-ply structure does notcomprise a microwave energy interactive material, such as thosedescribed in International Publication No. WO 2012/148895 (e.g., foilpatch, patterned foil, a susceptor, or combinations thereof).

In certain embodiments, the microwaved multi-ply structure furtherincludes additional layers, such as ink layers, nylon layers, additionaladhesive layers, additional polyester layers, or any combinationthereof. It is also contemplated that any of these additional layers maybe omitted from the microwaved multi-ply structure.

In some embodiments, the microwaved multi-ply structure furthercomprises an ink layer. For example, as illustrated in FIG. 2, themicrowaved multi-ply structure 200, which is a variation of themicrowaved multi-ply structure in FIG. 1, has an ink layer 112 that islocated between the barrier film 102 and the sealant film 110. In thisembodiment, the ink layer 112 is adjacent to the silicon oxide layer 106and the first polyester layer 104 is the outermost layer of themulti-ply structure 200. Non-limiting examples of suitable ink materialsinclude water-based inks, solvent-based inks, and the like, andcombinations thereof.

As used herein, the term “adjacent” means contiguous.

In certain embodiments, the microwaved multi-ply structure comprises oneor more nylon layers and one or more additional adhesive layers. Forexample, as illustrated in FIG. 3, the microwaved multi-ply structure300, which is a variation of the microwaved multi-ply structure 100 inFIG. 1, further includes a second adhesive layer 114 and a first nylonlayer 116. The second adhesive layer 114 is located between the barrierfilm 102 and the first nylon layer 116, whereas the first nylon layer116 is located between the first and the second adhesive layers 108,114. In this embodiment, the second adhesive layer 114 is adjacent tothe silicon oxide layer 106 and the first polyester layer 104 is theoutermost layer of the multi-ply structure 300.

As used herein, a “nylon layer” of the multi-ply structure that isseparate from the sealant film (i.e., a nylon layer that is not part ofthe sealant film) is a layer that predominately comprises one or morenylons. That is, a nylon layer comprises one or more nylons in an amountof at least 50% based on weight of the nylon layer. In one embodiment,the nylon layer comprises one or more nylons in an amount of about 80%to about 100% based on weight of the nylon layer. In another embodiment,the nylon layer comprises one or more nylons in an amount of about 95%to about 100% based on weight of the nylon layer. Non-limiting examplesof suitable nylons include biaxially oriented nylons, cast nylons, andthe like, and combinations thereof. For example, in one embodiment, theone or more nylon layers are biaxially oriented nylon. Non-limitingexamples of suitable nylon materials includes polyamides, such as nylon6, nylon 66, and nylon 6/66.

FIGS. 4 and 5 illustrate possible variations of the microwaved multi-plystructure 300 shown in FIG. 3. The microwaved multi-ply structures 400and 500 both include an ink layer 112. In FIG. 4, the ink layer 112 islocated between the barrier film 102 and the second adhesive layer 114.In this embodiment, the ink layer 112 is adjacent to the silicon oxidelayer 106. In FIG. 5, the ink layer 112 is located between the secondadhesive layer 114 and the first nylon layer 116. In both FIGS. 4 and 5,the first polyester layer 104 is the outermost layer of the multi-plystructures 400 and 500, respectively.

Another embodiment of the microwaved multi-ply structure is illustratedin FIG. 6. The microwaved multi-ply structure 600 is similar to themicrowaved multi-ply structure 300 in FIG. 3, except that the microwavedmulti-ply structure 600 further includes a third adhesive layer 118 anda second nylon layer 120. The third adhesive layer 118 is locatedbetween the barrier film 102 and the second nylon layer 120, whereas thesecond nylon layer 120 is located between the second and the thirdadhesive layers 114, 118. In this embodiment, the third adhesive layer118 is adjacent to the silicon oxide layer 106 and the first polyesterlayer 104 is the outermost layer of the multi-ply structure 600.

FIGS. 7 and 8 illustrate possible variations of the microwaved multi-plystructure 600 shown in FIG. 6. The microwaved multi-ply structures 700and 800 both include an ink layer 112. In FIG. 7, the ink layer 112 islocated between the barrier film 102 and the third adhesive layer 118.In this embodiment, the ink layer 112 is adjacent to the silicon oxidelayer 106. In FIG. 8, the ink layer 112 is located between the thirdadhesive layer 118 and the second nylon layer 120. In both FIGS. 7 and8, the first polyester layer 104 is the outermost layer of the multi-plystructures 700 and 800, respectively.

In some embodiments, each nylon layer of the one or more nylon layershas a thickness from about 48 gauge to about 100 gauge. In oneembodiment, each of the one or more nylon layers has a differentthickness. In another embodiment, each of the one or more nylon layershas equal thickness.

In certain embodiments, the microwaved multi-ply structure comprises oneor more additional polyester layers and one or more additional adhesivelayers. For example, as illustrated in FIG. 9, the microwaved multi-plystructure 900, which is a variation of the microwaved multi-plystructure 100 in FIG. 1, further includes a second adhesive layer 114and a second polyester layer 122. The second adhesive layer 114 islocated between the barrier film 102 and the second polyester layer 122.In this embodiment, the second adhesive layer 114 is adjacent to thefirst and second polyester layers 104, 122 and the second polyesterlayer 122 is the outermost layer of the microwaved multi-ply structure900. In another embodiment, as illustrated in FIG. 11, the secondadhesive layer 114 is adjacent to the silicon oxide layer 106, ratherthan the first polyester layer 104.

FIGS. 10 and 12 illustrate possible variations of the microwavedmulti-ply structures 900 and 1100 shown in FIGS. 9 and 11, respectively.The microwaved multi-ply structures 1000 and 1200 both include an inklayer 112 that is located between the second polyester layer 122 and thesecond adhesive layer 114.

In embodiments, the one or more additional polyester layers areindependent of the barrier film. That is, the one or more additionalpolyester layers are omitted from the barrier film. In some embodiments,each of the one or more additional polyester layers has a thickness fromabout 36 gauge to 120 gauge. In one embodiment, each of the one or moreadditional polyester layers has a different thickness. In anotherembodiment, each of the one or more additional polyester layers hasequal thickness.

In some embodiments, the microwaved multi-ply structure comprises one ormore nylon layers, one or more additional polyester layers, and one ormore additional adhesive layers. For example, as illustrated in FIG. 13,the microwaved multi-ply structure 1300, which is a variation of themicrowaved multi-ply structure 300 in FIG. 3, further includes a firstnylon layer 116, a second polyester layer 122, and two additionaladhesive layers 114, 118. The first nylon layer 116 is located betweenthe first and third adhesive layers 108, 118, whereas the secondpolyester layer 122 is located between the second and the third adhesivelayers 114, 118. The second adhesive layer 114 is located between thebarrier film 102 and the second polyester layer 122, whereas the thirdadhesive layer 118 is located between the second polyester layer 122 andthe first nylon layer 116. In this embodiment, the second adhesive layer114 is adjacent to the silicon oxide layer 106 and the first polyesterlayer 104 is the outermost layer of the microwaved multi-ply structure1300.

FIGS. 14 and 15 illustrate possible variations of the microwavedmulti-ply structure 1300 shown in FIG. 13. The microwaved multi-plystructures 1400 and 1500 both include an ink layer 112. In FIG. 14, theink layer 112 is located between the barrier film 102 and the secondadhesive layer 114. In this embodiment, the ink layer 112 is adjacent tothe silicon oxide layer 106. In FIG. 15, the ink layer 112 is locatedbetween the second adhesive layer 114 and the second polyester layer122. In both FIGS. 14 and 15, the first polyester layer 104 is theoutermost layer of the microwaved multi-ply structures 1400 and 1500,respectively.

Another embodiment of the microwaved multi-ply structure is illustratedin FIG. 16. The microwaved multi-ply structure 1600 is similar to themicrowaved multi-ply structure 900 in FIG. 9, except that the microwavedmulti-ply structure 1600 further includes a third adhesive layer 118 anda first nylon layer 116. The third adhesive layer 118 is located betweenthe barrier film 102 and the first nylon layer 116, whereas the firstnylon layer 116 is located between the first and the third adhesivelayers 108, 118. In this embodiment, the third adhesive layer 118 isadjacent to the silicon oxide layer 106 and the second polyester layer122 is the outermost layer of the microwaved multi-ply structure 1600.

FIGS. 17 and 18 illustrate possible variations of the microwavedmulti-ply structure 1600 shown in FIG. 16. The microwaved multi-plystructures 1700 and 1800 both include an ink layer 112. In FIG. 17, theink layer 112 is located between the second polyester layer 122 and thesecond adhesive layer 114. In FIG. 18, the ink layer 112 is locatedbetween the second adhesive layer 114 and the barrier film 102. In thisembodiment, the ink layer 112 is adjacent to the first polyester layer104. In both FIGS. 17 and 18, the second polyester layer 122 is theoutermost layer of the microwaved multi-ply structures 1700 and 1800,respectively.

Another embodiment of the microwaved multi-ply structure is illustratedin FIG. 19. The microwaved multi-ply structure 1900 is similar to themicrowaved multi-ply structure 1600 in FIG. 16, except that the secondadhesive layer 114 is adjacent to the silicon oxide layer 106, ratherthan the first polyester layer 104.

FIGS. 20 and 21 illustrate possible variations of the microwavedmulti-ply structure 1900 shown in FIG. 19. The microwaved multi-plystructures 2000 and 2100 both include an ink layer 112. In FIG. 20, theink layer 112 is located between the second polyester layer 122 and thesecond adhesive layer 114. In FIG. 18, the ink layer 112 is locatedbetween the second adhesive layer 114 and the barrier film 102. In thisembodiment, the ink layer 112 is adjacent to the silicon oxide layer106. In both FIGS. 20 and 21, the second polyester layer 122 is theoutermost layer of the microwaved multi-ply structures 2000 and 2100,respectively.

The sealant film 110 in any of the foregoing microwaved multi-plystructures includes at least one polypropylene layer, which is adjacentto the first adhesive layer 108 of the microwaved multi-ply structures.For example, as illustrated in FIG. 22, the sealant film 110A includes afirst polypropylene layer 124.

As used herein, a “polypropylene layer” is a layer that predominatelycomprises one or more polypropylenes. That is, a polypropylene layercomprises one or more polypropylene in an amount of at least 50% basedon weight of the polypropylene layer. In one embodiment, thepolypropylene layer comprises one or more polypropylenes in an amount ofabout 90% to about 100% based on weight of the polypropylene layer. Inone embodiment, the polypropylene layer comprises one or morepolypropylenes in an amount of about 95% to about 100% based on weightof the polypropylene layer.

The sealant film provided herein may be formed by any of theconventional processes for making sealant films, including blownextrusion, cast extrusion, or the like. It should be noted that anylayer of the sealant film described herein may be formed using a filmline with single or multiple extruders.

In certain embodiments, the multi-layered sealant film has a thicknessfrom about 1 mil to about 8 mil. In one embodiment, the multi-layeredsealant film has a thickness from about 2 mil to about 5 mil. In otherembodiments, the multi-layered sealant film has a thickness of 1 mil,1.5 mil, 2 mil, 2.5 mil, 3 mil, 3.5 mil, 4 mil, 4.5 mil, 5 mil, 5.5 mil,6 mil, 6.5 mil, 7 mil, 7.5 mil, or 8 mil. In other embodiments, themulti-layered sealant film of this disclosure also may have a thicknessbetween any of these recited thickness values.

In some embodiments, the sealant film 110 may include additional layers,such as additional polypropylene layers, a nylon layer, an easy-peellayer, or any combination thereof. Examples of these sealant films areillustrated in FIGS. 23-28 and may be the sealant film of any of theforegoing microwaved multi-ply structures. It is also contemplated thatany of these additional layers may be omitted from the sealant film.

In some embodiments, the sealant film does not comprise a nylon layer.In other embodiments, the sealant comprises one or more nylon layers.For example, in FIG. 23, the sealant film 110B includes twopolypropylene layers 124, 128, a nylon layer 126, and two tie layers130, 132. The nylon layer 126 is located between the first and secondpolypropylene layers 124, 128, where the first tie layer 130 is locatedbetween the first polypropylene layer 124 and the nylon layer 126 andthe second tie layer 132 is located between the nylon layer 126 and thesecond polypropylene layer 128. In this embodiment, the secondpolypropylene layer 128 is the innermost layer of the microwavedmulti-ply structure.

As used herein, a “nylon layer” of the sealant fil m is a layer thatpredominately comprises one or more nylons. That is, a nylon layercomprises one or more nylons in an amount of at least 50% based onweight of the nylon layer. In one embodiment, the nylon layer comprisesone or more nylons in an amount of about 80% to about 100% based onweight of the nylon layer. In another embodiment, the nylon layercomprises one or more nylons in an amount of about 95% to about 100%based on weight of the nylon layer. Non-limiting examples of suitablenylons do not include biaxially oriented nylons. Non-limiting examplesof suitable nylon materials include polyamides, such as nylon 6, nylon6,66, and nylon 66, and the like, and combinations thereof.

As used herein “innermost layer” means the last layer that is viewedfrom the outside of a reverse laminated structure and will typically bea layer that is in proximate to or in contact with product contained ina package made with such a structure (e.g., pouch) or in a packagehaving a portion made with such structure (e.g., lidding).

As used herein, a tie layer is an extruded resin layer that aids inadhering or bonding dissimilar layers of a co-extruded film together. Insome embodiments, one or more tie layers are included in the sealantfilm to adhere dissimilar layers of the sealant film together. Forpurposes of this disclosure, even though a tie laver aids in adheringand bonding, it is not an adhesive layer as defined herein.

Non-limiting examples of suitable tie layer materials includeanhydride-modified polyolefins (e.g., anhydride-modified polypropyleneor anhydride-modified polyethylene), modified ethylene vinyl acetate,anhydride-modified ethylene acrylate, acid/acrylate-modified ethylenevinyl acetate, anhydride-modified ethylene vinyl acetate,anhydride-modified ethylene methyl acrylate, ethylene methyl acrylate(EMA), and combinations thereof, and any of the foregoing materials incombination with polyolefins, such as polypropylene.

The type of materials in a tie layer is based, at least in part, on thematerials of the opposing layers of the film being bonded via the tielayer. For example, where a first tie layer is used to bond a firstpolypropylene laver and a nylon layer, the first tie layer may compriseanhydride-modified polypropylene, and where a second tie laver is usedto bond a second polypropylene and the nylon layer, the second tie layermay comprise anhydride-modified polypropylene.

In FIG. 24, the sealant film 110C includes a first polypropylene layer124 and an easy-peel layer 134. In this embodiment, the easy-peel layer134 is the innermost layer of the multi-ply structure. In oneembodiment, the easy-peel layer comprises a blend of a polypropylene, apolyethylene, an antiblock agent (e.g., diatomaceous earth), and a slipagent (e.g., erucamide). In another embodiment, the easy-peel layercomprises a blend of a polypropylene, an ethylene methyl acrylate (EMA),an antiblock agent (e.g., diatomaceous earth), and a slip agent (e.g.,erucamide).

Another embodiment of the sealant film is illustrated in FIG. 25. Thesealant film 110D includes two polypropylene layers 124, 128 and aneasy-peel layer 134. In this embodiment, the easy-peel layer 134 locatedbetween the first and the second polypropylene layers 124, 128 and thesecond polypropylene layer 128 is the innermost layer of the microwavedmulti-ply structure.

In FIG. 26, the sealant film 110E includes a first polypropylene layer124, a nylon layer 126, two ties layers 130, 132 and an easy-peel layer134. The nylon layer 126 is located between the first and secondpolypropylene layers 124, 128, where the first tie laver 130 is locatedbetween the first polypropylene layer 124 and the nylon layer 126 andthe second tie layer 132 is located between the nylon layer 126 and theeasy-peel layer 134. In this embodiment, the easy-peel layer 134 is theinnermost layer of the microwaved multi-ply structure.

FIGS. 27 and 28 illustrate possible variations of the sealant film 110Eshown in FIG. 26. The sealant films 110F and 110G both include a secondpolypropylene layer 128. In FIG. 27, the second polypropylene layer 128is adjacent to the easy-peel layer 134 and is the innermost layer of themicrowaved multi-ply structure. In FIG. 28, the second polypropylenelayer 128 is located between the second tie layer 132 and the easy-peellayer 134. In this embodiment, the easy-peel layer 134 is in theinnermost layer of the microwaved multi-ply structure.

In certain embodiments where the sealant film does not comprise aneasy-peel layer, the sealant film does not comprise polyethylene.

In any of the foregoing sealant film embodiments, the sealant film, insome embodiments, does not comprise solvent-based, water-based, orsolvent-less adhesives. In other embodiments, the sealant film of any ofthe foregoing sealant film embodiments is substantially free ofadhesive, i.e., solvent-based adhesives, water-based adhesives, and/orsolvent-less adhesives. As used herein “substantially free” means thatthe total amount of adhesive present within the sealant film is lessthan about 1% by weight of the multi-ply structure.

The multi-ply structures provided herein may be formed by any of theconventional processes for making multi-ply structures, includingadhesive lamination, extrusion lamination, blown film or cast film,extrusion coating, and combinations thereof. In certain embodiments, thebarrier film and/or the sealant film is formed off-line with respect tothe forming of the multi-ply structure. That is, the barrier film and/orthe sealant film can be formed in separate and independent preliminaryprocesses with respect to the process used to form the multi-plystructure. In embodiments where the multi-ply structure includes an inklayer, the ink layer is printed onto a formed layer or film during thefabrication of the multi-ply structure. In one embodiment, the barrierfilm is formed off-line in which the first polyester layer is formedthrough a cast film process with an in-line tenter frame and then thesilicon oxide layer is deposited via chemical vapor deposition onto thefirst polyester layer, and the sealant film is formed off-line via blownfilm or cast film process, after which the barrier film, the sealantfilm, and any other additional layer(s), such as nylon layer(s) and/oradditional polyester layer(s) are formed into the multi-ply structurevia adhesive lamination.

Packages

The multi-ply structures described herein may be used in a variety ofpackaging applications, such as in the formation of microwaved packages.In embodiments, the present multi-ply structures, prior to beingmicrowaved, may be formed in-line or off-line with the forming of apackage. In certain embodiments, a roll of film comprising the multi-plystructures, prior to being microwaved, described herein may be used toform a package. Once the package is formed, it is filled with product,sealed, and then microwaved in a pressurized vessel to form a microwavedpackage. In some embodiments, the pressurized vessel includes a fluidmedium. In one embodiment, the fluid medium is a liquid and the packageand the product disposed into the package is at least partially immersedin the liquid. In another embodiment, the fluid medium is steam.

As used herein, a “conventional microwaved package” is a package thatincludes a conventional microwaved multi-ply structure as definedherein. That is, a conventional microwaved package does not include astructure that includes a combination of at least a sealant film, afirst adhesive layer, and a barrier film in which the barrier filmcomprises a first polyester and a silicon oxide layer.

As used herein, a “conventional multi-ply structure” of a conventionalmicrowaved package is a conventional microwaved multi-ply structure asdefined herein.

As used herein, a “comparative package” is simply a non-microwavedsample of the subject microwaved package. That is, the comparativepackage is the same package as the microwaved package except that thecomparative package has not been microwaved (i.e., the comparativepackage has not undergone a MATS process). In some instances, thecomparative package has not undergone any thermal retort process,whereas in other instances, the comparative package has undergone aconventional thermal retort process.

In embodiments, the microwaved packages are sterilized during the MATSprocess. In embodiments where the microwaved packages contain a productdisposed within the package, the product is also sterilized.Additionally when the package contains a food or a drink product, theproduct is also pasteurized during the MATS process.

In one embodiment, the microwaved package includes a multi-ply structurethat defines an interior space of the package and a product disposedwithin the interior space. The multi-ply structure comprises a barrierfilm, which includes a first polyester layer and a silicon oxide layer,a first adhesive layer, and a sealant film, wherein the adhesive layeris located between the barrier film and the sealant film.

Non-limiting examples of suitable products include food products such assoups, ready meals, rice, meats, baby food, wet pet food, pasta,vegetable(s), and the like, drink products such as beverages and thelike, and pharmaceutical products.

In some embodiments, the package is in the form of a pouch. Exemplarypouches include stand-up pouches, four-side seal pouches, pillowpouches, c-fold pouches, step-cut, pinch bottom pouches, and chevronpouches. It should be noted that any of these exemplary pouches mayinclude one or more fitments (e.g., one or more spouts).

One embodiment of the microwaved package is illustrated in FIG. 29. InFIG. 29, the microwaved package 2900 is an exemplary stand-up pouch. Themicrowaved package 2900 is formed from the multi-ply structure 300 ofFIG. 3 in which the multi-ply structure 300 defines an interior space ofthe microwaved package 2900 and product is disposed within such space.

The present microwaved packages may be formed from a multi-ply structuredescribed herein, where the multi-ply structure is sealed to itself orto another film to form a pouch by forming heat seals about theperiphery of the pouch body. The other film may be the same or differentthan the multi-ply structure.

In another embodiment, the microwaved package includes a container bodyhaving a rim in which the container body defines an interior space ofthe package, product disposed within the interior space, and a multi-plystructure affixed to the rim. The multi-ply structure includes a barrierfilm comprising a first polyester layer and a silicon oxide layer, afirst adhesive layer, and a sealant film, wherein the first adhesivelayer is located between the barrier film and the sealant film. Incertain embodiments, the container body is rigid or semi-rigid.

In some embodiments, the container body is a rigid or semi-rigid tray orcup. In another embodiment, the container body is a flexible formed web.

FIG. 30 shows an exemplary package 3000 that includes a rigid orsemi-rigid container body 3010 having a rim (or flange) 3020, and themulti-ply structure 300 of FIG. 3. The multi-ply structure 300 isattached to the rim 3020. For example, the multi-ply structure 300 maybe heat sealed about the rim 3020 of the container body 3010.

The container body may be made of any suitable material, such asinjection molded or thermoformed polypropylene, polyethylene, and thelike; however, the composition of the container base and sealant film ofthe multi-ply structure should be compatible with one another so thatthe heat sealing creates a sealing interface between the container bodyand the multi-ply structure. In some embodiments, it may be desirablethat the multi-ply structure includes a pull tab that extends beyond therim of the container body to allow a user to more readily grasp and peelthe multi-ply structure to open the package.

In certain embodiments, the microwaved package includes one or morefitments. In other embodiments, the microwaved package includes at leastone pull tab. In one embodiment, the microwaved package includes one ormore fitments and at least one pull tab.

In some embodiments, the microwaved package does not comprise amicrowave energy interactive material, such as those described inInternational Publication No. WO 2012/148895 (e.g., foil patch,patterned foil, a susceptor, or combinations thereof).

Methods of Sterilization

The present multi-ply structures and the packages made therefrom aresuitable for use in sterilization processes. In particular, themulti-ply structures and packages of the present disclosure aresterilized via microwaved assisted thermal sterilization (MATS), such asthose described herein and in U.S. Pat. Nos. 5,436,432, 5,750,966,7,119,313, 7,230,217, 9,066,376, 9,179,505, and 9,271,338, and inInternational Publication Nos. WO 2016/044571, WO 2016/100539, and WO2015/171763, all of which are incorporated herein by reference.

In some embodiments, the method for sterilization includes feeding apackage, which the package has product disposed within an interior spacethereof, into a pressurized vessel, and exposing the package and theproduct within the pressurized vessel to microwave energy, where thepackage and the product are exposed to one or more cycles of microwaveenergy. The package includes a multi-ply structure as described herein.For example, in one embodiment, the multi-ply structure is the multi-plystructure illustrated 300 in FIG. 3, whereas in other embodiments, themulti-ply structure is the multi-ply structure 1300 as illustrated inFIG. 13.

As used herein, “one or more cycles” means one or more separateintervals.

In some embodiments, the pressurized vessel includes a fluid medium. Inone embodiment, the pressurized vessel includes a liquid and themulti-ply structure or the package is at least partially immersed in theliquid.

In some embodiments, during each cycle, the package and the product areexposed to about 5 kW to about 40 kW of microwave energy. In oneembodiment, during each cycle, the package and the product are exposedto 10 kW to about 30 kW of microwave energy.

In embodiments, the product is also pasteurized during the sterilizationprocess.

One exemplary method of sterilization is illustrated in FIG. 31. Themethod 3100 includes the method for sterilization includes feeding apackage having product disposed therein into a pressurized vessel 3110and exposing the package and the product to microwave energy 3120.

The present teachings may be further understood with reference to thefollowing non-limiting examples.

EXAMPLES

Various packages were prepared which included a container body, saltwater which served as the product, and a multi-ply structure sealed tothe container body. For each package, the container body was in the formof a rectangle tray and filled with salt water, and the multi-plystructure was heat sealed to the container body to form a sealedpackage.

SiO_(x) Packages: The multi-ply structure for each of these exemplarypackages includes a barrier film, a nylon layer, two adhesive layers,and a sealant film, as illustrated in FIG. 3. The below tableillustrates the compositional make-up of each exemplary multi-plystructure:

Film/Layer Material Barrier Film 48 gauge SiOx polyethyleneterephthalate (PET) (SiO_(X) PET) Adhesive Layer Solvent-basedpolyurethane adhesive Nylon Layer 60 gauge biaxially oriented nylon(BON) Adhesive Layer Solvent-based polyurethane adhesive Sealant Film2.75 mil white peelable polypropylene; or 2.75 mil polypropylene

Conventional Packages (Control): The multi-ply structure for eachconventional package is similar to the SiOx packages, except that thebarrier film in these packages is 48 gauge AlO_(x) PET.

Example 1

Ten SiO_(x) package samples and ten conventional package samples weremade according to the below manufacturing parameters. Two of the SiO_(x)package samples served as comparative package samples, which did notundergo a MATS process, whereas the remaining eight packages underwentmicrowave assisted thermal sterilization (MATS) processes-two packagesfor each MATS process condition indicated below. Similarly, two of theconventional package samples served as comparative conventional packagesamples, which did not undergo a MATS process, whereas the remainingeight packages underwent separate MATS processes-two packages for eachMATS process condition indicated below.

MANUFACTURING PARAMETERS SEAL SEAL DWELL FILL VOLUME TEMP PRESSUREVACUUM TIME 300 g 380° F. 4 bar 500 mbar 2 seconds

Except for the comparative samples, each set of two samples underwentone of the MATS processes indicated in the below table:

MATS MATS PROCESSING PROCESS PROCESSING CONDITIONS CONDITION PRE-HEATHEATING/MW COOLING 1 38° C. 121.7° C. | 60 psi | 4 passes 26° C. | 60psi | @ 20 kW| carrier speed 3 | 60 psi | 5 min in/sec | 30 sec dwellb/t 15 min passes | 10 min hold 2 38° C. 121.7° C. | 50 psi | 4 passes26° C. | 50 psi | @ 20 kW| carrier speed 3 | 50 psi | 5 min in/sec | 30sec dwell b/t 15 min passes | 10 min hold 3 38° C. 121.7° C. | 60 psi |6 passes 26° C. | 60 psi | @ 20 kW | carrier speed 3 | 60 psi | 5 minin/sec | 30 sec dwell b/t 15 min passes | 10 min hold 4 65° C. 121.7° C.60 psi | 6 passes 26° C. | 60 psi | @ 10 kW | carrier speed 3 | 60 psi |5 min in/sec | 30 sec dwell b/t 15 min passes | 10 min hold

After MATS, the moisture vapor transmission rate (MVTR) and oxygentransmission rate (OTR) were measured. The MVTR was measured for eachsample according to ASTM F1249 at 38° C. and 90% relative humidity, andthen the average MVTR of the two samples of each process condition,i.e., Conditions 1-4, and the average MVTR of each set of comparativepackage samples, which did not undergo a MATS process condition, werecalculated. The OTR was measured for each sample according to ASTM D3985with 100% O₂ at 30° C. and 70% relative humidity, and then the averageOTR of the two samples of each process condition and the average OTR ofeach set of comparative package samples were calculated. The below tablesummarizes the average MVTR and the average OTR for each sample set.

POST-MATS BARRIER TEST RESULTS Conventional Packages (Control) SiOxPackages OTR OTR 100% O2/ MVTR 100% O2/ MVTR 30° C./ 38° C./ 30° C./ 38°C./ MATS 70% RH 90% 70% RH 90% PROCESS cc/100 in RH g/100 cc/100 in RHg/100 SAMPLE CON- 2/24 hr in 2/24 2/24 hr in 2/24 SET DITION (Avg) hr(Avg) (Avg) hr (Avg) 1 1 0.0753 0.1101 0.0076 0.0234 2 2 0.0812 0.11510.0084 0.0227 3 3 0.0583 0.109  0.01   0.0261 4 4 0.0258 0.0925 0.00920.0185 Comparative NONE 0.0022 0.025  0.0028 0.0076

As can be seen from the above table, the exemplary SiO_(x) packages havelower OTRs as compared to the control packages. Specifically, theexemplary SiO_(x) packages have OTRs up to 10 times lower at certainMATS processing conditions compared to the control packages. Also, theexemplary SiO_(x) packages have lower MVTRs as compared to the controlpackages. Moreover, the OTR and MVTR of the SiO_(x) packages weremaintained over a broader range of MATS processing conditions ascompared to the control packages.

Example 2

Four SiO_(x) package samples were made according to the SiO_(x) packagesin example 1 above. Two SiO_(x) package samples underwent a first retortprocess, R1, and two SiO_(x) package samples underwent a second retortprocess, R2. The process parameters for each retort process was asfollows:

Retort Process Retort Process Conditions R1 250° F.| 30 psi | 60 min R2265° F.| 35 psi | 30 min

After the conventional thermal retort process, the MVTR and OTR weremeasured. The MVTR was measured for each sample according to ASTM F1249at 38° C. and 90% relative humidity, and the average MVTR of the twosamples of each process condition was calculated. The OTR was measuredfor each sample according to ASTM D3985 with 100% O₂ at 23° C. and 0%relative humidity, and the average OTR of the two samples of eachprocess condition was calculated. The below table summarizes the averageMVTR and OTR of the samples for retort process.

MVTR OTR 38° C./90% RH 100% O₂/23° C./0% RH Retort Process g/100 in²/24hr Avg cc/100 in²/24 hr Avg R1 0.0519 0.0037 R2 0.1178 0.0157

As can be seen from the above table, it was unexpectedly discovered thatthe MVTR of samples R1 and R2 were higher than the MVTR of the samplesthat underwent a MATS process in example 1. That is, the MVTR of theMATS samples had a lower MVTR compared to samples R1 and R2, whichunderwent conventional thermal retort. Additionally, it was alsosurprising that the OTR of sample R2 was higher than the OTR of the MATSsamples in example 1. Thus, this data illustrates that a barrier filmthat includes SiOx PET results in a post-MATS package (microwavedpackage) having barrier properties, at least with respect to MVTR, thatare generally superior to those of the post-conventional thermal retortpackages.

The following numbered embodiments, aspects, and features of thedisclosure are provided, with an emphasis on the ability to combine thevarious features which may disclosed only in certain embodiments, intoother disclosed embodiments, as the context and technical reason allow.

EMBODIMENTS

Clause 1. A multi-ply structure comprising:

a barrier film comprising a first polyester layer and a silicon oxidelayer;

a first adhesive layer, and

a sealant film,

wherein the first adhesive layer is located between the barrier film andthe sealant film, and

wherein the multi-ply structure has been microwaved in a pressurizedvessel.

Clause 2. The multi-ply structure of clause 1, wherein the multi-plystructure is flexible.

Clause 3. The multi-ply structure of clause 1 or 2, wherein themulti-ply structure is substantially polymeric.

Clause 4. The multi-ply structure of any one of clauses 1 to 3, whereinthe pressurized vessel comprises a liquid and the multi-ply structure isat least partially immersed in the liquid.

Clause 5. The multi-ply structure of any one of clauses 1 to 4, whereinthe microwaved multi-ply structure is sterilized.

Clause 6. The multi-ply structure of any one of clauses 1 to 5, whereinthe multi-ply structure does not comprise a microwave energy interactivematerial.

Clause 7. The multi-ply structure of any one of clauses 1 to 6, whereinthe microwaved multi-ply structure has a moisture vapor transmissionrate from about 0.005 g/100 in²/day to about 0.06 g/100 in²/day.

Clause 8. The multi-ply structure of any one of clauses 1 to 6, whereinthe microwaved multi-ply structure has a moisture vapor transmissionrate that is about 0% to about 1,100% greater than a comparativemoisture vapor transmission rate of a comparative multi-ply structurethat has not been microwaved in the pressurized vessel.

Clause 9. The multi-ply structure of any one of clauses 1 to 6, whereinthe microwaved multi-ply structure has a moisture vapor transmissionrate that is about 50% to about 99% lower than a comparative moisturevapor transmission rate of a conventional microwaved multi-plystructure.

Clause 10. The multi-ply structure of any one of clauses 1 to 9, whereinthe microwaved multi-ply structure has an oxygen transmission rate fromabout 0.001 cc/100 in²/day to about 0.03 cc/100 in²/day.

Clause 11. The multi-ply structure of any one of clauses 1 to 9, whereinthe microwaved multi-ply structure has an oxygen transmission rate thatis about 0% to about 2,900% greater than a comparative oxygentransmission rate of a comparative multi-ply structure that has not beenmicrowaved in the pressurized vessel.

Clause 12. The multi-ply structure of any one of clauses 1 to 9, whereinthe microwaved multi-ply structure has an oxygen transmission rate thatis between 0% to 100% lower than a comparative oxygen transmission rateof a conventional microwaved multi-ply structure.

Clause 13. The multi-ply structure of any one of clauses 1 to 12,further comprising an ink layer located between the barrier film and thefirst adhesive layer.

Clause 14. The multi-ply structure of any one of clauses 1 to 12,further comprising a second adhesive layer and a first nylon layer,wherein the second adhesive layer is located between the barrier filmand the first nylon layer, and the first nylon layer is located betweenthe first and the second adhesive layers.

Clause 15. The multi-ply structure of clause 14, further comprising athird adhesive layer and a second polyester layer, wherein the thirdadhesive layer is located between the first nylon layer and the secondpolyester layer, and the second polyester layer is located between thesecond and the third adhesive layers.

Clause 16. The multi-ply structure of clause 14 or 15, furthercomprising an ink layer that is located between (i) the barrier film andthe second adhesive layer. (ii) the first nylon layer and the secondadhesive layer, or (iii) the second adhesive layer and the secondpolyester layer.

Clause 17. The multi-ply structure of clause 14, further comprising athird adhesive layer and a second nylon layer, wherein the thirdadhesive layer is located between the barrier film and the second nylonlayer, and the second nylon layer is located between the second and thethird adhesive layers.

Clause 18. The multi-ply structure of clause 17, further comprising anink layer that is located between either (i) the barrier film and thethird adhesive layer or (ii) the third adhesive layer and the secondnylon layer.

Clause 19. The multi-ply film structure of any one of clauses 1 to 12,further comprising a second polyester layer and a second adhesive layer,wherein the second adhesive layer is located between the secondpolyester layer and the barrier film, and the barrier film is locatedbetween the first and the second adhesive layers.

Clause 20. The multi-ply structure of clause 19, further comprising anink layer that is located between the second polyester layer and thesecond adhesive layer.

Clause 21. The multi-ply structure of clause 19, further comprising athird adhesive layer and a nylon layer, wherein the nylon layer islocated between the first and the third adhesive layers, and the thirdadhesive layer is located between the barrier film and the nylon layer.

Clause 22. The multi-ply structure of clause 21, further comprising anink layer that is located between either (i) the second polyester layerand the second adhesive layer or (ii) the second adhesive layer and thebarrier film.

Clause 23. The multi-ply structure of any one of clauses 1 to 22,wherein the sealant film comprises a first polypropylene layer that isadjacent to the first adhesive layer.

Clause 24. The multi-ply structure of clause 23, wherein the sealantfilm further comprises an easy-peel layer.

Clause 25. The multi-ply structure of clause 24, wherein the sealantfilm further comprises a second polypropylene layer, wherein theeasy-peel layer is located between the first and the secondpolypropylene layers.

Clause 26. The multi-ply structure of any one of clauses 19 to 25,wherein the first polyester layer is adjacent to either (i) the secondadhesive layer or (ii) the ink layer.

Clause 27. A package comprising:

a multi-ply structure that defines an interior space of the package; and

a product disposed within the interior space,

wherein the multi-ply structure comprises,

-   -   a barrier film comprising a first polyester layer and a silicon        oxide layer;        -   a first adhesive layer; and        -   a sealant film,

wherein the adhesive layer is located between the barrier film and thesealant film, and

wherein the package has been microwaved in a pressurized vessel.

Clause 28. The package of clause 27, wherein the package is in the formof a pouch.

Clause 29 The package of clause 28, further comprising one or morefitments.

Clause 30. A package comprising:

-   -   a container body having a rim, the container body defining an        interior space of the package;    -   product disposed within the interior space; and    -   a multi-ply structure affixed to the rim, the multi-ply        structure comprising:        -   a barrier film comprising a first polyester layer and a            silicon oxide layer;        -   a first adhesive layer, and        -   a sealant film,            -   wherein the first adhesive layer is located between the                barrier film and the sealant film, and    -   wherein the package has been microwaved in a pressurized vessel.

Clause 31. The package of clause 30, further comprising at least onepull tab.

Clause 32. The package of any one of clauses 27 to 31, wherein thepressurized vessel comprises a liquid and the package and the product isat least partially immersed in the liquid.

Clause 33. The package of any one of clauses 27 to 32, wherein thepackage does not comprise a microwave energy interactive material.

Clause 34. The package of any one of clauses 27 to 33, wherein themulti-ply structure of the microwaved package is flexible.

Clause 35. The package of any one of clauses 27 to 34, wherein themulti-ply structure of the microwaved package is substantiallypolymeric.

Clause 36. The package of any one of clauses 27 to 35, wherein themicrowaved package and product are sterilized.

Clause 37. The package of any one of clauses 27 to 36, wherein theproduct is a food product or a drink product.

Clause 38. The package of clause 37, wherein the product is pasteurized.

Clause 39. The package of any one of clauses 27 to 38, wherein themulti-ply structure of the microwaved package has a moisture vaportransmission rate from about 0.005 g/100 in²/day to about 0.06 g/100in²/day.

Clause 40. The package of any one of clauses 27 to 38, wherein themulti-ply structure of the microwaved package has a moisture vaportransmission rate that is about 0% to about 1,100% greater than acomparative moisture vapor transmission rate of a comparative multi-plystructure of a comparative package that has not been microwaved in thepressurized vessel.

Clause 41. The package of any one of clauses 27 to 38, wherein themulti-ply structure of the microwaved package has a moisture vaportransmission rate that is about 50% to about 99% lower than acomparative moisture vapor transmission rate of a conventional multi-plystructure of a conventional microwaved package.

Clause 42. The package of any one of clauses 27 to 41, wherein themulti-ply structure of the microwaved package has an oxygen transmissionrate from about 0.001 cc/100 in²/day to about 0.03 cc/100 in²/day.

Clause 43. The package of any one of clauses 27 to 41, wherein themulti-ply structure of the microwaved package has an oxygen transmissionrate that is about 0% to about 2,900% greater than a comparative oxygentransmission rate of a comparative multi-ply structure of a comparativepackage that has not been microwaved in the pressurized vessel.

Clause 44. The package of any one of clauses 27 to 41, wherein themulti-ply structure of the microwaved package has an oxygen transmissionrate that is between 0% to 100% lower than a comparative oxygentransmission rate of a conventional multi-ply structure of aconventional microwaved package.

Clause 45. The package of any one of clauses 27 to 44, wherein themulti-ply structure further comprises an ink layer located between thebarrier film and the first adhesive layer.

Clause 46. The package of any one of clauses 27 to 44, wherein themulti-ply structure further comprises a second adhesive layer and afirst nylon layer, wherein the second adhesive layer is located betweenthe barrier film and the first nylon layer, and the first nylon layer islocated between the first and the second adhesive layers.

Clause 47. The package of clause 46, wherein the multi-ply structurefurther comprises a third adhesive layer and a second polyester layer,wherein the third adhesive layer is located between the first nylonlayer and the second polyester layer, and the second polyester layer islocated between the second and the third adhesive layers.

Clause 48. The package of clause 46 or 47, wherein the multi-plystructure further comprises an ink layer that is located between (i) thebarrier film and the second adhesive layer. (ii) the first nylon layerand the second adhesive layer, or (iii) the second adhesive layer andthe second polyester layer.

Clause 49. The package of clause 46, wherein the multi-ply structurefurther comprises a third adhesive layer and a second nylon layer,wherein the third adhesive layer is located between the barrier film andthe second nylon layer, and the second nylon layer is located betweenthe second and the third adhesive layers.

Clause 50. The package of clause 49, wherein the multi-ply structurefurther comprises an ink layer that is located between either (i) thebarrier film and the third adhesive layer or (ii) the third adhesivelayer and the second nylon layer.

Clause 51. The package of any one of clauses 27 to 44, wherein themulti-ply structure further comprises a second polyester layer and asecond adhesive layer, wherein the second adhesive layer is locatedbetween the second polyester layer and the barrier film, and the barrierfilm is located between the first and the second adhesive layers.

Clause 52 The package of clause 51, wherein the multi-ply structurefurther comprises an ink layer that is located between the secondpolyester layer and the second adhesive layer.

Clause 53. The package of clause 51, wherein the multi-ply structurefurther comprises a third adhesive layer and a nylon layer, wherein thenylon layer is located between the first and the third adhesive layers,and the third adhesive layer is located between the barrier film and thenylon layer.

Clause 54. The package of clause 53, wherein the multi-ply structurefurther comprises an ink layer that is located between either (i) thesecond polyester layer and the second adhesive layer or (ii) the secondadhesive layer and the barrier film.

Clause 55. The package of any one of clauses 27 to 54, wherein thesealant film comprises a first polypropylene layer that is adjacent tothe first adhesive layer.

Clause 56. The package of clause 55, wherein the sealant film furthercomprises an easy-peel layer.

Clause 57. The package of clause 56, wherein the sealant film furthercomprises a second polypropylene layer, wherein the easy-peel layer islocated between the first and the second polypropylene layers.

Clause 58. The package of any one of clauses 51 to 57, wherein the firstpolyester layer is adjacent to either (i) the second adhesive layer or(ii) the ink layer.

Clause 59. A method for sterilization, the method comprising:

-   -   feeding a package into a pressurized vessel, the package having        product disposed within an interior space of the package,        wherein the package comprises a multi-ply structure comprising,        -   a barrier film comprising a first polyester layer and a            silicon oxide layer,        -   a first adhesive layer, and        -   a sealant film,        -   wherein the first adhesive layer is located between the            barrier film and the sealant film, and    -   exposing the package and the product within the pressurized        vessel to one or more cycles of microwave energy.

Clause 60. The method of clause 59, wherein the pressurized vesselcomprises a liquid and the package and the product are at leastpartially immersed in the liquid when exposed to the microwave energy.

Clause 61. The method of clause 59 or 60, wherein, during each cycle,the package and the product are exposed to about 5 kW to about 40 kW ofmicrowave energy.

Clause 62. The method of any one of clauses 59 to 61, wherein themulti-ply structure of the microwaved package is flexible.

Clause 63. The method of any one of clauses 59 to 62, wherein themulti-ply structure of the microwaved package is substantiallypolymeric.

Clause 64. The method of any one of clauses 59 to 63, wherein theproduct is a food product or a drink product, and wherein the product ispasteurized.

Clause 65. The method of any one of clauses 59 to 64, wherein thepackage does not comprise a microwave energy interactive material.

Clause 66. The method of any one of clauses 59 to 65, wherein themulti-ply structure of the microwaved package has a moisture vaportransmission rate from about 0.005 g/100 in²/day to about 0.06 g/100in²/day.

Clause 67. The method of any one of clauses 59 to 65, wherein themulti-ply structure of the microwaved package has a moisture vaportransmission rate that is about 0% to about 1,100% greater than acomparative moisture vapor transmission rate of a comparative multi-plystructure of a comparative package that has not been exposed tomicrowave energy in the pressurized vessel.

Clause 68. The method of any one of clauses 59 to 65, wherein themulti-ply structure of the microwaved package has a moisture vaportransmission rate that is about 50% to about 99% lower than acomparative moisture vapor transmission rate of a conventional multi-plystructure of a conventional microwaved package.

Clause 69. The method of any one of clauses 59 to 68, wherein themulti-ply structure of the microwaved package has an oxygen transmissionrate from about 0.001 cc/100 in²/day to about 0.03 cc/100 in²/day.

Clause 70. The method of any one of clauses 59 to 68, wherein themulti-ply structure of the microwaved package has an oxygen transmissionrate that is about 0% to about 2,900% greater than a comparative oxygentransmission rate of a comparative multi-ply structure of a comparativepackage that has not been exposed to microwave energy in the pressurizedvessel.

Clause 71. The method of any one of clauses 59 to 68, wherein themulti-ply structure of the microwaved package has an oxygen transmissionrate that is between 0% to 100% lower than a comparative oxygentransmission rate of a conventional multi-ply structure of aconventional microwaved package.

Clause 72. The method of any one of clauses 59 to 71, wherein themicrowaved package is in the form of a pouch that is formed from themulti-ply structure.

Clause 73. The method of clause 72, wherein the package furthercomprises one or more fitments.

Clause 74. The method of any one of clauses 59 to 71, wherein thepackage further comprises a container body having a rim and themulti-ply structure is affixed to the rim.

Clause 75. The method of clause 74, wherein the package comprises atleast one pull tab.

Clause 76. The method of any one of clauses 59 to 75, wherein themulti-ply structure further comprises an ink layer located between thebarrier film and the first adhesive layer.

Clause 77. The method of any one of clauses 59 to 75, wherein themulti-ply structure further comprises a second adhesive layer and afirst nylon layer, wherein the second adhesive layer is located betweenthe barrier film and the first nylon layer, and the first nylon layer islocated between the first and the second adhesive layers.

Clause 78. The method of clause 77, wherein the multi-ply structurefurther comprises a third adhesive layer and a second polyester layer,wherein the third adhesive layer is located between the first nylonlayer and the second polyester layer, and the second polyester layer islocated between the second and the third adhesive layers.

Clause 79. The method of clause 77 or 78, wherein the multi-plystructure further comprises an ink layer that is located between (i) thebarrier film and the second adhesive layer, (ii) the first nylon layerand the second adhesive layer, or (iii) the second adhesive layer andthe second polyester layer.

Clause 80. The method of clause 77, wherein the multi-ply structurefurther comprises a third adhesive layer and a second nylon layer,wherein the third adhesive layer is located between the barrier film andthe second nylon layer, and the second nylon layer is located betweenthe second and the third adhesive layers.

Clause 81. The method of clause 80, wherein the multi-ply structurefurther comprises an ink layer that is located between either (i) thebarrier film and the third adhesive layer or (ii) the third adhesivelayer and the second nylon layer.

Clause 82. The method of any one of clauses 59 to 75, wherein themulti-ply structure further comprises a second polyester layer and asecond adhesive layer, wherein the second adhesive layer is locatedbetween the second polyester layer and the barrier film, and the barrierfilm is located between the first and the second adhesive layers.

Clause 83. The method of clause 82, wherein the multi-ply structurefurther comprises an ink layer that is located between the secondpolyester layer and the second adhesive layer.

Clause 84. The method of clause 82, wherein the multi-ply structurefurther comprises a third adhesive layer and a nylon layer, wherein thenylon layer is located between the first and the third adhesive layers,and the third adhesive layer is located between the barrier film and thenylon layer.

Clause 85. The method of clause 84, wherein the multi-ply structurefurther comprises an ink layer that is located between either (i) thesecond polyester layer and the second adhesive layer or (ii) the secondadhesive layer and the barrier film.

Clause 86. The method of any one of clauses 59 to 85, wherein thesealant film comprises a first polypropylene layer that is adjacent tothe first adhesive layer.

Clause 87 The method of clause 86, wherein the sealant film furthercomprises an easy-peel layer.

Clause 88. The method of clause 87, wherein the sealant film furthercomprises a second polypropylene layer, wherein the easy-peel layer islocated between the first and the second polypropylene layers.

Clause 89. The method of any one of clauses 82 to 88, wherein the firstpolyester layer is adjacent to either (i) the second adhesive layer or(ii) the ink layer.

Clause 90. A microwaved multi-ply structure, as disclosed herein.

Clause 91. A microwaved package, as disclosed herein.

Clause 92. A method for sterilization of a package, as disclosed herein.

For the purposes of describing and defining the present teachings, it isnoted that unless indicated otherwise, the term “substantially” isutilized herein to represent the inherent degree of uncertainty that maybe attributed to any quantitative comparison, value, measurement, orother representation. The term “substantially” is also utilized hereinto represent the degree by which a quantitative representation may varyfrom a stated reference without resulting in a change in the basicfunction of the subject matter at issue.

It will be appreciated that various above-disclosed and other featuresand functions, or alternatives thereof, may be desirably combined intomany other different products or applications. Various presentlyunforeseen or unanticipated alternatives, modifications, variations, orimprovements therein may be subsequently made by those skilled in theart which are also intended to be encompassed by the following claims.

We claim:
 1. A package comprising: a multi-ply structure that defines aninterior space of the package, the multi-ply structure comprising: abarrier film comprising a first polyester layer and a silicon oxidelayer; a sealant film; and a first adhesive layer comprising asolvent-based polyurethane adhesive located between the barrier film andthe sealant film; wherein the multi-ply structure does not comprise amicrowave energy interactive material, and a product disposed within theinterior space, wherein the package has been microwaved in a pressurizedvessel.
 2. The package of claim 1, wherein the package is in the form ofa pouch.
 3. The package of claim 1, wherein the microwaved multi-plystructure has a moisture vapor transmission rate from about 0.005 g/100in²/day to about 0.06 g/100 in²/day.
 4. A package comprising: acontainer body having a rim, the container body defining an interiorspace of the package; product disposed within the interior space; and amulti-ply structure affixed to the rim comprising: a barrier filmcomprising a first polyester layer and a silicon oxide layer; a sealantfilm; and a first adhesive layer comprising a solvent-based polyurethaneadhesive located between the barrier film and the sealant film; whereinthe multi-ply structure does not comprise a microwave energy interactivematerial, and wherein the package has been microwaved in a pressurizedvessel.
 5. The package of claim 4, wherein the multi-ply structure ofthe microwaved package has a moisture vapor transmission rate from about0.005 g/100 in²/day to about 0.06 g/100 in²/day.
 6. The package of claim4, wherein the multi-ply structure of the microwaved package has amoisture vapor transmission rate that is about 50% to about 99% lowerthan a comparative moisture vapor transmission rate of a comparativemulti-ply structure of a conventional microwaved package.
 7. The packageof claim 4, wherein the multi-ply structure of the microwaved packagehas an oxygen transmission rate from about 0.001 cc/100 in²/day to about0.03 cc/100 in²/day.
 8. The package of claim 4, wherein the multi-plystructure of the microwaved package has an oxygen transmission rate thatis about 0% to about 2,900% greater than a comparative oxygentransmission rate of a comparative multi-ply structure of a comparativepackage that has not been microwaved in the pressurized vessel.
 9. Thepackage of claim 4, wherein the multi-ply structure of the microwavedpackage has an oxygen transmission rate that is between 0% to 100% lowerthan a comparative oxygen transmission rate of a conventional multi-plystructure of a conventional microwaved package.
 10. The package of claim4, wherein the multi-ply structure further comprises a second adhesivelayer and a first nylon layer, wherein the second adhesive layer islocated between the barrier film and the first nylon layer, and thefirst nylon layer is located between the first and the second adhesivelayers.
 11. The package of claim 10, wherein the multi-ply structurefurther comprises a third adhesive layer and a second polyester layer,wherein the third adhesive layer is located between the first nylonlayer and the second polyester layer, and the second polyester layer islocated between the second and the third adhesive layers.
 12. Thepackage of claim 10, wherein the multi-ply structure further comprisesan ink layer that is located between (i) the barrier film and the secondadhesive layer, (ii) the first nylon layer and the second adhesivelayer, or (iii) the second adhesive layer and the second polyesterlayer.
 13. The package of claim 10, wherein the multi-ply structurefurther comprises a third adhesive layer and a second nylon layer,wherein the third adhesive layer is located between the barrier film andthe second nylon layer, and the second nylon layer is located betweenthe second and the third adhesive layers.
 14. The package of claim 4,wherein the multi-ply structure further comprises a second polyesterlayer and a second adhesive layer, wherein the second adhesive layer islocated between the second polyester layer and the barrier film, and thebarrier film is located between the first and the second adhesivelayers.
 15. The package of claim 14, wherein the multi-ply structurefurther comprises a third adhesive layer and a nylon layer, wherein thenylon layer is located between the first and the third adhesive layers,and the third adhesive layer is located between the barrier film and thenylon layer.
 16. The package of claim 4, wherein the sealant filmcomprises a first polypropylene layer that is adjacent to the firstadhesive layer.
 17. The package of claim 16, wherein the sealant filmfurther comprises an easy-peel layer.
 18. The package of claim 17,wherein the sealant film further comprises a second polypropylene layer,wherein the easy-peel layer is located between the first and the secondpolypropylene layers.
 19. A package comprising: a multi-ply structurethat defines an interior space of the package, the multi-ply structurecomprising: a barrier film comprising a first polyester layer and asilicon oxide layer; a sealant film; and a first adhesive layercomprising a solvent-based polyurethane adhesive located between thebarrier film and the sealant film; wherein the multi-ply structure doesnot comprise a microwave energy interactive material, and wherein thepackage is configured to contain a product disposed within the interiorspace, and wherein the package is configured to be microwaved in apressurized vessel.
 20. The package of claim 19, wherein when thepackage has been microwaved in the pressurized vessel, the multi-plystructure of the microwaved package has an oxygen transmission rate fromabout 0.001 cc/100 in²/day to about 0.03 cc/100 in²/day.